Microwave Ceramics and Modules
Filter
2 Pole Filter for WLAN 5GHz / [5150 - 5850] MHz
B69842N5507B700
Preliminary datasheet
ISSUE DATE
10.06.03
ISSUE
P1
PUBLISHER
SAW MWC PD F
PAGE
1/4
Features
SMD filter consisting of coupled resonators with stepped impedances
MgTiO3 - CaTiO3 (
r = 21 / TCf =010 ppm/K) with a coating of copper (10
m) and tin (>5
m)
Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page
2
Component drawing
Recommended footprint
Page
3
Characteristics
Maximum ratings
Typical passband characteristic
Page
4
Processing information
Soldering requirements
Delivery mode
Microwave Ceramics and Modules
Filter
2 Pole Filter for WLAN 5GHz / [5150 - 5850] MHz
B69842N5507B700
Preliminary datasheet
ISSUE DATE
10.06.03
ISSUE
P1
PUBLISHER
SAW MWC PD F
PAGE
3/4
Characteristics
min.
typ.
max.
Center frequency
fc 5.5
GHz
Insertion loss [5150 5850] MHz
IL 1.4
1.5
dB
Passband [5150 5850] MHz
B 700
MHz
Amplitude ripple (peak - peak) [5150 5850] MHz
dB
Standing wave ratio [5150 5850] MHz
SWR 1.8
2.0
Impedance
Power
Z
P
50
1.0
W
Attenuation
at DC to 2170 MHz
at 2400 to 2500 MHz
at 2500 to 3900 MHz
at 6800 MHz
40
40
30
18
45
43
39
20
dB
dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
Operating temperature
Top -40 / +85
C
Typical passband characteristic
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
500
2500
4500
6500
8500
10500
12500
frequency [MHz]
attenuation [dB]
S11 [dB]
S21 [dB]
Microwave Ceramics and Modules
Filter
2 Pole Filter for WLAN 5GHz / [5150 - 5850] MHz
B69842N5507B700
Preliminary datasheet
ISSUE DATE
10.06.03
ISSUE
P1
PUBLISHER
SAW MWC PD F
PAGE
4/4
Processing information
ZNr.: 577 (FILT95_2)
Wettability to IEC 68-2-58:
75% (after aging)
Soldering requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type
reflow
reflow
Maximum soldering temperature 235
(max. 2 sec.)
260 (max. 2 sec.)
C
(measuring point on top surface of the component) 225 (max. 10 sec.)
250 (max. 10 sec.) C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [C]
215C10C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [C]
245C5C
2.5 C/s
> - 5 C/s
eutectic SnPb solder paste profile
leadfree solder paste profile
Delivery mode
Blister tape acc. to IEC 286-3, PS, grey
Pieces/tape: t.b.d.
t.b.d.
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers'
Association), unless otherwise agreed.
PDF 
ZIP